Indium8.9HF1
Pb-Free Solder Paste
Indium8.9HF1 is an air reflow, no-clean solder paste. Indium8.9HF1 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF1 minimizes false failures in ICT.
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Features
- High oxidation barrier to eliminate graping and HIP defects
- Highly probe-testable flux residue
- Halogen-free per EN14582 test method
- Excellent print transfer efficiency on 0.4mm pitch CSPs
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