Indium5.7LT-1
Low-Temperature Solder Paste
Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-based low-temperature alloys. This paste is a clear residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT-1, in combination with the SnBi alloys, can be especially useful as a low-temperature, Pb-free solution.
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Features
- Low-temperature Pb-free solution
- Outstanding printing transfer efficiency with low variation between prints
- Clear post-reflow flux residue
- Solder beading and solder balling minimization performance
- Exceptional wetting in air and nitrogen reflow
- Halogen-free per EN14582 test method
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