Indium3.2HF Pb-Free
Water-Soluble Solder Paste
Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, Sn/Sb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
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Features
- Exceptional printing
- Long stencil life
- Good response-to-pause
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
- Low-voiding
- Halogen-free
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