CORE 230-RC
No-Spatter, No-Clean, REACH-Compliant Robotic Soldering Wire
Indium Corporation’s CORE 230-RC is a formula developed to meet the demanding requirements of robotic and laser soldering. It incorporates a highly effective activator package with new “no-spatter” technology in a high-reliability flux media. CORE 230-RC is fully REACH-compliant, containing no REACH substance of very high concern (SVHCs). CORE 230-RC is not used solely for robotic and laser soldering since it also performs exceptionally well in hand soldering applications. The no-spatter feature eliminates flux spatters that can burn operators’ hands.
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Features
- Low-spatter formulation
- Light-colored residue
- Compatible with Pb-free and SnPb alloys
- Available within Indalloy®292C alloy
- Compatible with HASL, Immersion Silver, ENIG, and OSP surface finishes
Process Recommendations
- Match the tip size to the part to be soldered
- Apply the solder wire to the joint, not to the soldering iron tip
- Use the lowest temperature possible
- 610–700°F (320–370°C) for SnPb and Pb-free
- Surface mount (SMT) soldering should be completed in 1–2 seconds
- Plated through-hole (PTH) soldering should be completed in 1–3 seconds
- The robotic soldering process set-up is highly customizable and depends on the assembly being soldered
- A smooth solder joint appearance requires the correct amount of temperature and time; fine-tuning the process parameters may be required to achieve the best possible outcome
- During robotic soldering, flux build-up and charring may occur; to avoid build-up, increase the iron tip cleaning frequency or reduce the iron tip temperature
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